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CY3436 Gold-plated Silicon Wafer (Au/Ti Coated SiO2/Si Substrate)

Catalog No
CY3436
Material
Au, Ti, SiO2, Si
Resistivity
1-20 ohm.cm
Polishing
One side polished
Substrate Size
100/50mm diameter, Thickness 0.525 mm/0.279mm
Surface Roughness
< 10 A RMS

Au/Ti-coated SiO₂/Si substrates are utilized in the fields of nanotechnology, scanning electron microscopy (SEM), atomic force microscopy (AFM), and a variety of other scanning probe microscopy applications. Stanford Optics boasts extensive experience in the manufacture and supply of high-quality optical products. 

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Au/Ti Coated SiO2/Si Substrate
Au/Ti Coated SiO2/Si Substrate
Description
Specifications
Reviews

Au/Ti Coated SiO2/Si Substrate Description

Our gold-plated silicon wafers serve as exceptional substrates, extensively utilized in the nanotechnology sector, scanning electron microscopy (SEM), atomic force microscopy (AFM), and various scanning probe microscopy applications. Additionally, they are ideal for cell culture, protein and DNA microarrays, and reflectometry. Each silicon wafer is meticulously coated with a 2 nm layer of titanium, followed by a 50 nm gold film, ensuring superior performance and reliability.

Au/Ti Coated SiO2/Si Substrate Applications

Our Au/Ti coated SiO₂/Si substrates are indispensable in the nanotechnology field, seamlessly integrating with SEM, AFM, and other scanning probe microscopy techniques. They are also pivotal in cell culture experiments, protein and DNA microarray development, and reflectometric analyses, providing a reliable foundation for advanced scientific research and technological innovations.

Au/Ti Coated SiO2/Si Substrate Packaging

Each Au/Ti coated SiO₂/Si substrate is handled with utmost care during storage and transportation. Our stringent packaging protocols ensure that the substrates maintain their pristine condition, safeguarding their quality and performance upon delivery.

Specifications

Composition

Au, Ti, SiO2, Si

Film

Au(111)=50 nm

Ti=2 nm

SiO2=300 nm

Si(100) P type B doped ~525 um Prime Grade

 

Resistivity

1-20 ohm.cm

Substrate Size

100/50mm diameter,

Thickness 0.525 mm/0.279mm

Polish

One side polished

Surface roughness

< 10 A RMS

Maximum Thermal Budget of Au film: 

below 200 ℃

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